Future Factories With 6G: Agentic AI and Cyber–Physical Digital Twins
Published in IEEE Internet of Things Journal, 2026
Haiyuan Li, Hari Madhukumar, Nicholas Methley, Xuewen Chen, Yulei Wu, Juan Parra-Ullauri, Vishnu Dutt Sharma, Jeongran Lee, Arndt Ryo Koblitz, Matthew Andrews, Sige Liu, Yansha Deng, Oluwatayo Y. Kolawole, Andrea Tassi, Dimitra Simeonidou (2026). "Future Factories With 6G: Agentic AI and Cyber–Physical Digital Twins."
IEEE Internet of Things Journal, vol. 13, no. 9, pp. 17990-18006
Recommended citation: Li, H., Madhukumar, H., Methley, N., Chen, X., Wu, Y., Parra-Ullauri, J., Sharma, V. D., Lee, J., Koblitz, A. R., Andrews, M., Liu, S., Deng, Y., Kolawole, O. Y., Tassi, A., & Simeonidou, D. (2026). “Future Factories With 6G: Agentic AI and Cyber–Physical Digital Twins.” IEEE Internet of Things Journal, 13(9), 17990-18006.